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PCBA components SMT surface mount technology soldering process circuit board design electronic components integrated circuits resistors capacitors inductors diodes transistors PCB manufacturing wave soldering reflow soldering BOM test points package types QFP BGA SOP sensors connectors relays power modules microcontrollers memory chips oscillators filters transformers heat sinks ESD protection AOI flying probe test functional testing surface mount through hole FPC PCB mixed assembly component sourcing alternate parts supply chain management inventory turnover pick and place solder paste printing stencil design conformal coating potting compound thermal components withstand voltage test impedance control files soldering defects cold joints short circuits open circuits IPC standards RoHS lead free process automotive electronics industrial control consumer electronics medical devices communication modules RF components power devices analog circuits digital circuits package sizes 0402 0603 0805 1206 DIP thermal management HDI blind vias buried vias multilayer PCB aluminum substrate FR4 materials component brands TI ST Microchip Murata Samsung TDK
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